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Activity (Hands-On)Grades 9 - 10

Under Pressure: Using Young’s Modulus to Explore Material Properties

A image of an Arduino Uno microcontroller.A top view of an Arduino Uno.

Students explore Young’s Modulus by investigating how materials respond to stress and strain, measuring their stiffness and flexibility using Arduino technology. Through hands-on experimentation, students learn how variations in force application can affect the accuracy of their measurements. Building on this knowledge, they apply the engineering design process to create a device that ensures a consistent pressure and angle during testing, improving the reliability of their results.

Materials engineers use Young’s Modulus to evaluate a material's stiffness or elasticity, which determines how it deforms under stress. This property helps engineers select appropriate materials for specific applications, ensuring they meet the required strength, flexibility, or rigidity. For example, materials with a high Young's Modulus, such as steel, are used in structures needing stiffness, while those with a low Young’s Modulus, such as rubber, are ideal for flexible applications. By analyzing stress-strain relationships, engineers can design safe and efficient products, optimize material usage, and predict how materials will perform under various forces.

After this activity, students should be able to:

  • Determine the average rate of change on various sections of a curve.
  • Demonstrate understanding of Young’s Modulus, including its significance in measuring material stiffness or flexibility and its role in material selection.
  • Explore and categorize materials, learning to recognize their characteristics and discuss their potential applications in engineering contexts.

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